your packaging engineering partner

AN INTEGRATED R&D DEPARTMENT WHICH REPRESENTS 25% OF THE STAFF:
- DESIGN IN 3D OF THE MACHINE FOR A BETTER CONFORMITY WITH THE HIGHEST HYGIENE REQUIREMENTS [EHEDG, FDA, CSA ….]
- SPECIFIC MACHINE DESIGN FOR EACH CUSTOMER APPLICATION
INNOVATED TECHNOLOGY :
- ULTRASONIC, IMPULSE, THERMAL AND HIGH FREQUENCY SEALING
- FILLING [SPECIFIC DESIGN FOR EACH PRODUCT]
- DEVELOPMENT OF ULTRA-CLEAN AND ASEPTIC EQUIPMENT
Thimonnier unveiled its new generation SF machine dedicated to the filling and capping of preformed DOYPACK® pouches
Join us in Düsseldorf, Hall 6, Stand B79, and discover an exclusive preview of…
Come and visit us at FRANKFURT - stand HALL12.0 booth A79
Thimonnier will exhibit in CFIA, at the french benchmark event for the food-processing sector.
Come to visit our booth HALL10 C2.
We regularly take part in trade shows all around the world – great opportunities to meet in person! We’ll be delighted to welcome you to our stands.?