your packaging engineering partner

Thimonnier will be exhibiting at ANUGA FOODTEC trade show in Cologne, a global trade event dedicated to technologies for the food and beverage industry.
We look forward to welcoming you to our booth, located in HALL 8, A-088, and showing you the new generation of fully configurable machines for DOYPACK®: the TH-FLEX!
Designed to meet new industrial requirements for agility, performance, and scalability, the TH-FLEX is based on independent magnetic shuttle technology (B&R Automation’s ACOPOS 6D technology), offering completely free and configurable kinematics.
Come see us at ANUGA FOODTEC in Cologne.
The Thimonnier sales team looks forward to welcoming you at our booth, Hall 8, Booth A-088
Thimonnier unveiled its new generation machine dedicated to the filling and capping of preformed DOYPACK® pouches
Join us in Düsseldorf, Hall 6, Stand B79, and discover an exclusive preview of…
Come and visit us at FRANKFURT - stand HALL12.0 booth A79
Thimonnier will exhibit in CFIA, at the french benchmark event for the food-processing sector.
Come to visit our booth HALL10 C2.