your packaging engineering partner













We regularly take part in trade shows all around the world – great opportunities to meet in person! We’ll be delighted to welcome you to our stands.?
Come see us at ANUGA FOODTEC in Cologne.
The Thimonnier sales team looks forward to welcoming you at our booth, Hall 8, Booth A-088
Thimonnier unveiled its new generation machine dedicated to the filling and capping of preformed DOYPACK® pouches