your packaging engineering partner

From 10 to 12 March 2026, Thimonnier will be participating in the CFIA 2026 trade show in Rennes.
Our sales team will welcome you at its stand located in HALL 10-C2, within the GEPPIA village.
During these three days, it will present our flexible packaging filling solutions dedicated to the food, cosmetics and detergent sectors.
Come see us at ANUGA FOODTEC in Cologne.
The Thimonnier sales team looks forward to welcoming you at our booth, Hall 8, Booth A-088
Thimonnier unveiled its new generation machine dedicated to the filling and capping of preformed DOYPACK® pouches
Join us in Düsseldorf, Hall 6, Stand B79, and discover an exclusive preview of…
Come and visit us at FRANKFURT - stand HALL12.0 booth A79
Thimonnier will exhibit in CFIA, at the french benchmark event for the food-processing sector.
Come to visit our booth HALL10 C2.