your packaging engineering partner
Known to be an expert in radio frequency in materials of flexible welding materials for over 70 years, Thimonnier will attend the Techtextil Fair from April 23st to 26th 2024, Hall 12.0 stand A26
This is an opportunity to discuss your projects in leather goods, welded cloting, plastic paper mill, taut structures and the automotive industry.
We'll show you the machines we design and help you realise your project.
Come see us at ANUGA FOODTEC in Cologne.
The Thimonnier sales team looks forward to welcoming you at our booth, Hall 8, Booth A-088
Thimonnier unveiled its new generation machine dedicated to the filling and capping of preformed DOYPACK® pouches
Join us in Düsseldorf, Hall 6, Stand B79, and discover an exclusive preview of…
Come and visit us at FRANKFURT - stand HALL12.0 booth A79
Thimonnier will exhibit in CFIA, at the french benchmark event for the food-processing sector.
Come to visit our booth HALL10 C2.