your packaging engineering partner

From november 21th to 23th 2023, we will welcome you in HALL 6 on our stand H103 to present you our filling solutions in flexible packaging for food, cosmetics and detergents.
Come see us at ANUGA FOODTEC in Cologne.
The Thimonnier sales team looks forward to welcoming you at our booth, Hall 8, Booth A-088
Thimonnier unveiled its new generation machine dedicated to the filling and capping of preformed DOYPACK® pouches
Join us in Düsseldorf, Hall 6, Stand B79, and discover an exclusive preview of…
Come and visit us at FRANKFURT - stand HALL12.0 booth A79
Thimonnier will exhibit in CFIA, at the french benchmark event for the food-processing sector.
Come to visit our booth HALL10 C2.