your packaging engineering partner

? All the Thimonnier team wishes you a HAPPY NEW YEAR 2023 full of success, collaborations and innovations !
? Hope to meet you on exhibitions in 2023 to propose you customised solutions solutions and share our sealing and filling know-how for flexible packaging.
Come see us at ANUGA FOODTEC in Cologne.
The Thimonnier sales team looks forward to welcoming you at our booth, Hall 8, Booth A-088
Thimonnier unveiled its new generation machine dedicated to the filling and capping of preformed DOYPACK® pouches
Join us in Düsseldorf, Hall 6, Stand B79, and discover an exclusive preview of…
Come and visit us at FRANKFURT - stand HALL12.0 booth A79
Thimonnier will exhibit in CFIA, at the french benchmark event for the food-processing sector.
Come to visit our booth HALL10 C2.