your packaging engineering partner
The Andina-Pack is the meeting point and business center for the packaging sector in Latin America. It brings together exhibitors from different parts of the world, presenting the latest technological innovations in the sector, reflected in a diverse portfolio of machinery, equipment and services, providing the professional visitors from the whole continent the assurance of finding comprehensive solutions for their packaging needs.
The Andina-Pack takes place for the 14th time on 4 days from Tue., 07.11.2017 to Fri., 10.11.2017 in Bogota.
Come see us at ANUGA FOODTEC in Cologne.
The Thimonnier sales team looks forward to welcoming you at our booth, Hall 8, Booth A-088
Thimonnier unveiled its new generation machine dedicated to the filling and capping of preformed DOYPACK® pouches
Join us in Düsseldorf, Hall 6, Stand B79, and discover an exclusive preview of…
Come and visit us at FRANKFURT - stand HALL12.0 booth A79
Thimonnier will exhibit in CFIA, at the french benchmark event for the food-processing sector.
Come to visit our booth HALL10 C2.