your packaging engineering partner

PACK EXPO CHICAGO - from October 21 to 26, 2022

Starting October 23rd, 2022, to the 26th, Thimonnier and HOOD PACKAGING will exhibit side by side stand N5568 at the Chicago PACK EXPO in the largest convention center in the United States, McCormick Place.

For 25 years, Thimonnier and HOOD PACKAGING have been partners and North America leaders in packing milk in pouches.

Thanks to this persistent and reliable partnership, HOOD PACKAGING provides its customers with a complete premium solution: packaging, Thimonnier automatic filler machines (VFFS), equipment maintenance and assistance. 



We can’t wait to discuss further with you during the PACK EXPO so do not hesitate and visit us !