your packaging engineering partner
BOOTH S 80 - 84
Come to visit us in HOOD PACKAGING booth, GLOPAK division, to discover the SF200, new generation of spout filling machines for DOYPACK® pouches!
Our colleague Bruno is hitting the road for the Twing Raid!
From 24 February to 5 March, he and his sister will be taking part in the third edition of the Twing Raid, a charity rally in the desert.
Thimonnier will exhibit in CFIA, at the french benchmark event for the food-processing sector.
Come to visit our booth HALL10 C2.
✨In 2026, let’s build your difference togethe
On 21 November, twenty Thimonnier employees took part in the Course des Lumières alongside the Hospices Civils de Lyon Foundation.
We regularly take part in trade shows all around the world – great opportunities to meet in person! We’ll be delighted to welcome you to our stands.?